Microelectronic packaging technology - materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989
- Författare
- ASM International Wei T. Shieh ASM International Electronic Materials and Processing Congress 1989 : Philadelphia)
- (Edited by Wei T. Shieh sponsored by the Electronic Materials and Processing Division of ASM International.)
- Genre
- Bibliografi, Konferenspublikation, Konferenser, Ej skönlitteratur
- Språk
- Engelska
| Förlag | År | Ort | Om boken | ISBN |
|---|---|---|---|---|
| ASM International | cop. 1989 | USA, Metals Park, Ohio | xii, 479 sidor. ill. 29 cm. |